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TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1o @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350oC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300oC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370oC.

TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5