關(guān)鍵詞 |
漢高ABLESTIKJM7000導(dǎo)電膠 |
面向地區(qū) |
ABLESTIK JM7000具有高可靠性，低空洞特點(diǎn)，耐高溫可達(dá)370度。
常用超大規(guī)模集成電路封裝，陶瓷焊接封裝和焊接密封封裝
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5
青島本地漢高ABLESTIKJM7000導(dǎo)電膠熱銷信息
